Our Services

  • Surface Mount, Thru Hole or Mixed Technology Assembly
  • Complex SATCOM/Microwave Assembly
  • Prototypes, NPI and full scale Production
  • Turnkey or Kitted
  • CCA, Cable and Box Build Assembly
  • Design for Manufacturing
  • Component Obsolescence
  • KANBAN Pull Systems

Our Capabilities

  • No limitations on BGA, LGA, QFN, DFN, QFP, TSOP or SSOP
  • No limitations on chip components down to 0201's
  • No limitations on thru-hole technology
  • No Limitations on PWB Materials or Complexity
  • Quality per IPC-A-610 class 2 and 3
  • Process Control per J-STD-001
  • Rework per IPC-7711
  • Repair per ICP-7721
  • No limitations on component removal and replacement
  • No limitations on BGA removal, re-balling and replacement
  • Proprietary Compression Reflow process for complex microwave assembly
  • Complex solder preform design