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Surface Mount Assembly

Low to Mid Volume Production:  HMS utilizes MYDATA Pick-and-Place machines that are equipped with electrical verification and state-of-the-art camera and laser vision systems. This ensures that all parts picked are either electrically verified and/or visually verified before they are placed onto the PCB.  HMS has three MYDATA Production lines.  Each Line is rated at 20K CPH.


Mid to High Volume Production:  HMS utilizes JUKI Pick-and-Place machines equipped with electrical verification, state-of-the-art camera, and laser vision systems. These specifications ensure that all parts picked are either electrically verified and/or visually verified before they are placed onto the PCB.  HMS has three JUKI Lines. Two are rated at 15K CPH and one at 75K CPH.
Screen Printing:  HMS utilizes either MPM Momentum or Momentum Elite on its Pick-and-Place lines.  All are equipped with 2D solder paste inspection and all boards are programmed for 100% solder paste inspection post-print.  For rapid prototyping, HMS maintains several semi-automated and manual screen printers to allow for unplanned emergency runs.
Automated Optical Inspection: HMS utilizes Nordson YESTECH FX AOI equipped with Advanced Fusion Lighting to accomplish extremely comprehensive optical inspection. Each board is programmed for 100% coverage.

Through-Hole Assembly

Low to Mid Volume Production:  HMS utilizes Nordson Selective Soldering Machines.  Selective Soldering Machines allow for customized programs with zero downtime changeovers.  This benefits HMS with great flexibility in the production schedule through high and low volume environments. The speed of these machines allows for mid-volume production. They are also equipped with Drop Jet Fluxing technology that preforms highly accurate flux deposition, leaving minimal residue after soldering. Selective soldering also reduces the cycle time of quick turn jobs due to no need for intricate wave solder pallets to prevent unwanted solder bridges to adjacent circuits and component leads.
Prototype and Low Production:  HMS has a team of highly experienced electrical assemblers that are trained to IPC-A-610 and J-S-STD-001 standards as well as advanced soldering techniques. HMS can design and 3D print or mill its own assembly fixtures in-house, further reducing cycle times on quick-turn prototype jobs.  Additionally, HMS has developed a proprietary process for fast set up and processing of quick-turn prototype small batch runs.
Dispensing Technologies: HMS utilizes Camalot and Fisnar Robotic Dispensing Equipment to dispense solder paste so we can perform solder touch up for package size mismatch or design paradoxes. This is necessary on mixed technology boards that have a combination of new and old SMT packages. For example, when not enough paste is printed for larger parts. With focused dispensing of solder paste on these larger components, we can eliminate touch up after SMT reflow.
Assembly Cleaning: HMS utilizes both in-line and batch Aqueous cleaning with chemistry as well as Solvent Vapor Degreasing, depending on the customer requirements for flux chemistry.  As a process control measure, boards are tested for Ionic Contamination using SCS Instruments Lonograph 500M LP to ensure they meet the requirement of J-STD-001 section 
Conformal Coating: HMS sprays Humiseal 1B31 Acrylic Conformal Coating daily.  We also apply Humiseal 1C51 Silicone Conformal Coating.  Spray operators are trained and certified for this operation.
Potting: HMS has extensive experience developing the potting process for products that operate in harsh environments. With deep connections within the materials science sectors, HMS can help connect customers with an industry-leading material scientist to help select the ideal materials for their project. HMS is experienced in developing custom potting processes, including vacuum potting.
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