NPI and Rapid Prototyping

PCB Assembly

Mechanical Assembly


Testing Solutions

Supply Chain Solutions

Our Capabilities

  • No limitations on BGA, LGA, QFN, DFN, QFP, TSOP or SSOP

  • No limitations on chip components down to 0201's

  • No limitations on thru-hole technology

  • No Limitations on PWB Materials or Complexity

  • Quality per IPC-A-610 class 2 and 3

  • Process Control per J-STD-001

  • Rework per IPC-7711

  • Repair per IPC-7721

  • No limitations on component removal and replacement

  • No limitations on BGA removal, re-balling and replacement

  • Proprietary Compression Reflow process for complex microwave assembly

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